186 Flux Pen - Kester 186 Flux Pen - Mildly Activated Rosin Liquid Flux...
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- Part Number:
- 186 Flux Pen
- Model Number:
- 186 Flux Pen
- Make:
- KESTER
- Lead Time:
- Available
- Qty In Stock:
- Available
Kester 186 Flux Pen - Mildly Activated Rosin Liquid Flux Pen Simple Type: Accessory
Kester 186 Flux Pen is specifically designed for leaded and lead-free rework of conventional and surface mount circuit board assemblies. Kester 186 under MIL-F-14256, was QPL approved as Type RMA. Although the fluxing ability approaches that of Type RA flux, residues after soldering are non-corrosive and non-conductive. Kester 186 has been developed for use in critical applications where difficult assemblies are to be soldered, but process requirements stipulate use of Type RMA flux. Kester 186 possess high thermal stability for soldering multi-layer assemblies which require higher temperatures. Exposure to high preheat temperatures does not degrade solubility of the residue in normal cleaning solvents. There is no surface insulation resistance degradation caused by the flux residue. The use of a minimum of ionic activating agents and the inactive nature of the residue permits leaving the residue on circuit board assemblies for many applications. The flux residue is also moisture and fungus resistant.
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Features
- Classified as ROL0 per J-STD-004
- Eliminates the need and expense of cleaning
- High thermal stability
- Improves soldering performance
Specifications
- Acid Number (typical): 55.5 mg KOH/g of flux Tested to J-STD-004, IPC-TM-650, Method 2.3.13
- Chloride and Bromides: 0.02% Tested to J-STD-004, IPC-TM-650, Method 2.3.35
- Copper Mirror Corrosion: Low Tested to J-STD-004, IPC-TM-650, Method 2.3.32
- Corrosion Test: Low Tested to J-STD-004, IPC-TM-650, Method 2.6.15
- Fluorides by Spot Test: Pass Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1
- Percent Solids (typical): 36 Tested to J-STD-004, IPC-TM-650, Method 2.3.34
- Silver Chromate: Pass Tested to J-STD-004, IPC-TM-650, Method 2.3.33
- SIR, IPC (typical): Pass Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3
- Specific Gravity: 0.879 ± 0.003 Antoine Paar DMA 35 @ 25°C
Applications
- None Available
Aliases
- None Available